Equipment configuration:
High-throughput scanning for patterned wafer inspection
Product Description
Adjusts dynamically to all die regions to deliver maximum sensitivity and improved detection of killer defects in a single scan, regardless of pattern density.
Features faster recipe setup, fewer setup parameters, improved recipe robustness, and user-friendly setup templates.
Enables improved cost of ownership through use of larger spot sizes with similar sensitivity results.
Extends a fab's inspection capability while leveraging existing learning and capital investment in the AIT II and AIT III.
Enables process monitoring and copper CMP inspection through enhanced signal-to-noise and nuisance filtering.